Defective Analysis Etching Device '200FA/200R/200I'
Removal of unnecessary areas through stripping treatment! Introducing the defective analysis etching equipment handled by our company.
The "200FA/200R/200I" is a defect analysis device for semiconductor chips and wafers. Through the delamination process, it is possible to remove unnecessary areas and analyze the causes of defects. 【Features】 ■ Selectable delamination technologies (RIE, HCD, ICPRIE) ■ Flexibility in sample shapes (die, package die, wafer fragments, full wafers) ■ Flexibility in transport (direct load, pre-load shuttle, pre-load shuttle with load lock) * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
- Company：プラズマ・サーモ・ジャパン
- Price：Other
